MG Chemicals 4900P SAC305 Lead Free Solder Paste 4900P-25G

High-Performance Solder Paste for Electronics Manufacturing The Mg Chemicals 4900P-25G Solder Paste is a high-performance, No Clean, Low Flux solder paste designed to facilitate high-speed printing in electronics manufacturing applications. With its unique alloy composition of 88 ...High-Performance Solder Paste for Electronics Manufacturing The Mg Chemicals 4900P-25G Solder Paste is a high-performance, No Clean, Low Flux solder paste designed to facilitate high-speed printing in electronics manufacturing applications. With its unique alloy composition of 88.5% Sn96.2Ag2.8Cu0.4, this solder paste exceeds J-STD-006C and meets ASTM B 32 purity requirements, ensuring reliable performance and consistent results.

Consistent Printing Characteristics The 4900P Solder Paste is formulated to provide repeatable and consistent printing characteristics, even when using ultra-fine pitch stencils as small as 0.3 mm. This ensures that your production process remains efficient and effective, with minimal downtime and reduced waste. Long Stencil and Tack Life One of the key benefits of the 4900P Solder Paste is its long stencil and tack life, which allows for high-speed printing without the need for frequent stencil cleaning or replacement.

This means you can produce more components in less time, without sacrificing quality. Excellent Wettability and Durability The 4900P Solder Paste features excellent wettability, ensuring strong, consistent bonds between components. Additionally, its medium soft, non-cracking residues provide improved durability and reduced risk of component failure.

Flexibility and Versatility The 4900P Solder Paste is suitable for use in air or nitrogen atmospheres, providing maximum flexibility and versatility in your production process. Whether you're working with delicate components or high-reliability applications, this solder paste is up to the task.